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Scientist - Material Mechanics/Reliability

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Date: Jan 27, 2023

Location: Corning, NY, US, 14831

Company: Corning

Requisition Number: 59490


Corning is vital to progress – in the industries we help shape and in the world we share.

We invent life-changing technologies using materials science. Our scientific and manufacturing expertise, boundless curiosity, and commitment to purposeful invention place us at the center of the way the world interacts, works, learns, and lives.

Our sustained investment in research, development, and invention means we’re always ready to solve the toughest challenges alongside our customers. 


Purpose of the Position:

We are looking for scientists and engineers with the ability to creatively solve problems and provide solutions to address some of the most pressing challenges to our businesses and define future research directions. This is a research position that requires sound understanding of mechanics of materials, reliability sciences and material characterization techniques. Candidate is expected to use the afore mentioned fields of study for the solving of technical problems in various R&D projects, both fundamental and applied. Candidate will extensively work on the understanding of the material mechanics performance of thin films / coating when deposited on various substrates. Additionally, the right candidate is expected to understand the role of various environmental conditions on the reliability and performance of various material systems, products and prototypes. Ideal candidate should also be interested in research studies related to the use of glass, glass-ceramics and ceramics as a substrate in microelectronics and MEMS applications. The successful candidate will work closely with teams of outstanding scientists and engineers located at our historical state-of-art research center in Corning, NY, as well as other global locations. Additionally, since our environment is dynamic, projects can be fast-paced; we expect our scientists and engineers to be agile and rapidly build up new capabilities as the need arises.


Day to Day Responsibilities

  • Support the daily activities in the lab related to the assessment of thin-film behavior and performance
  • Measurement of water absorption coefficient of thin films / coatings
  • Thermo-mechanical assessment of materials / prototypes / products
  • Design-of-experiment (DOE) for assessing reliability assessment
  • Execution of experimental plans
  • Documentation and presentation of research activities
  • Performance of FMEA analysis, with the end goal of assessing and potentially mitigating identified failure modes
  • Data compilation and analysis
  • Submission of samples for analysis with different subject matter experts
  • Physics-of-failure approach to solving reliability challenges
  • Solve integration challenges associated with the use of glass, glass-ceramics and ceramics substrates as a substrate in microelectronics, opto-electronics and MEMS applications


Education and Experience

  •  BSc. or MSc. in Material Science or Mechanical Engineering or related field.


Required Experience:

  • Minimum of 3 years’ experience is required for BSc. degree holders. MSc degree holders without previous experience are also eligible to apply.


Required Skills

  • Experience and knowledge in the fields of mechanics of materials, thermo-mechanical analysis, fractography, fracture mechanics and reliability sciences.
  • Familiarity with reliability engineering, statistical analysis, and hands-on testing
  • Solid experience of working in a lab
  • Experience in performing structural analysis using finite element analysis (FEA) software (e.g., Ansys) is a plus
  • Experience with solving material mechanics problems in systems comprising of multi-component material sets.
  • Experience with assessing the material behavior thin films / coatings or 2D materials – metals, polymers, oxides, nitrides, etc
  • Critical thinking and the application of the scientific method for problem solving
  • Basic understanding of different material characterization techniques
  • Understanding of adhesion science is a plus
  • Strong mathematical skills, having the ability to perform analytical modeling
  • Experience with the use of mathematical software such as Excel, MATLAB, JMP, Origin, etc.
  • Experience with microelectronics packaging is a plus
  • Understanding of how the structure / microstructure of thin films impact its material behavior
  • Experience with physics-of-failure approach to reliability problem solving


Soft Skills

  • Should have sound communication skills - verbal and written
  • Should be comfortable with making oral presentations to team members and the technology    community
  • Work involves interaction with different project members, labs, and subject matter experts, as such, having great interpersonal skills and a sound collaborative spirit is critical
  • Ability to multi-task is a needed skill, as applicant is expected to work simultaneously on multiple projects
  • Self-motivated
  • Hardworking and applies rigor to their work
  • Strong organizational skills


Travel requirements:

  • Occasional international and domestic travel based on business needs. A reasonable estimate ≤ 10%.


Hours of work/work schedule/flex-time:

  • 40 Hours/Week


This position does support immigration sponsorship.


We prohibit discrimination on the basis of race, color, gender, age, religion, national origin, sexual orientation, gender identity or expression, disability, veteran status or any other legally protected status.


We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment. Please contact us to request accommodation.

Nearest Major Market: Corning