Advanced Packaging & Metallization Expert

Advanced Packaging & Metallization Expert Glass Core Program | Corning Incorporated

Join a team pioneering glass-based solutions for next-generation semiconductor packaging. This role offers the opportunity to shape future technology platforms enabling AI, high-performance computing, and advanced electronics while working closely with leading customers and partners across the semiconductor industry.

Corning is seeking an experienced Advanced Packaging & Metallization Expert to join the Glass Core development team as a senior individual contributor. This role will provide technical leadership in the development and commercialization of next-generation glass substrate technologies for AI, high-performance computing, networking, and advanced semiconductor applications.

The successful candidate will be a recognized expert in semiconductor packaging, interconnect formation, and metallization processes, with the ability to influence technology strategy, guide development projects, and collaborate with customers and ecosystem partners across the semiconductor value chain.

Key Responsibilities
• Lead technical development of advanced packaging and metallization solutions for Glass Core.
• Contribute to development of glass core technology roadmap to enable next-generation package architectures, including 2.5D, 3D, chiplet, and heterogeneous integration platforms.
• Provide expertise in substrate interconnects, through-glass vias (TGVs), redistribution layers (RDL), electroplating, thin-film deposition, and advanced conductor technologies.
• Engage with customers, foundries, OSATs, substrate manufacturers, and equipment suppliers to define requirements and accelerate technology adoption.
• Identify technology gaps, drive innovation, and support commercialization strategies.
• Contribute to intellectual property development, technical publications, and industry engagement activities.
• Collaborate with global cross-functional teams spanning materials, process development and engineering, manufacturing, and business development.

Required Qualifications
• M.S. or Ph.D. in Electrical Engineering, Physics, Materials Science, Chemical Engineering or a related field.
• 10+ years of experience in semiconductor packaging, substrate technology, metallization processes, or related areas.
• Deep expertise in metallization processes, including sputtering, electroplating, seed-layer deposition, and surface finishing technologies.
• Strong understanding of advanced packaging architectures, package assembly, reliability, thermal management, and electrical performance.
• Demonstrated ability to lead complex technical initiatives and influence multidisciplinary teams.
• Excellent communication and customer-facing skills.

Preferred Qualifications
• 15+ years of industry experience.
• Experience with glass substrates, TGV technologies, chiplet integration, metallization, fine-pitch interconnects, or advanced substrate manufacturing.
• Established relationships within the semiconductor packaging ecosystem.
• Strong record of patents, publications, and successful technology commercialization.

Travel Requirements: 30-50% Location: Asia (South Korea or Taiwan, preferred)