Engineer I & II
Apply now »Date: Dec 1, 2025
Location: Taipei, TW, 105
Company: Corning
Role Purpose
Act as a technical engagement leader to drive technology collaboration with semiconductor customers and ensure technical resources are aligned to achieve business objectives in advanced packaging and optics fields.
• Deliver customer technology roadmaps and technical reports focused on semiconductor advanced packaging and optics technologies.
• Collect insights on industry trends and technological advancements for strategic planning.
• Execute and manage technology collaboration projects to meet predefined objectives.
• Leverage collaborative achievements to support business growth and innovation.
• Lead customer engagement initiatives, activities, and workshops.
• Build and expand value chain networks to enhance competitiveness.
• Explore new collaboration opportunities with both existing and potential customers.
Key Responsibilities
- Customer Engagement:
• Develop and maintain strong relationships with key stakeholders in semiconductor companies, focusing on R&D, engineering, and advanced packaging teams.
• Expand networks through proactive engagement, cold calls, industry events, exhibitions and leveraging existing networks within the semiconductor ecosystem.
• Identify key decision-makers and influencers for collaboration projects and
opportunities in advanced packaging and optics.
Technology Collaboration:
• Gather and analyze customer insights to enhance the technology portfolio.
• Define customer needs and align internal resources to create tailored technology solutions.
• Track technology trends and provide insights to guide internal strategies and planning.
Project Management:
• Lead technology collaboration projects, managing cross-functional teams to deliver objectives.
• Optimize project pipelines to maximize customer and business value.
• Identify opportunities for co-development and technology partnerships to strengthen customer relationships and expand business opportunities.
Industry Networking:
• Build and expand networks within the semiconductor packaging and optics value chain to identify opportunities for collaboration.
Experiences/Education - Required
- • Bachelor's degree or higher in Science, Engineering, or a related field.
• Experience in project management, business development, or marketing is preferred but not required.
• Familiarity with advanced packaging and optics technologies, including their applications and extensions.
• Keen awareness of the industry landscape, market trends, and competitive intelligence in advanced packaging and optics.
• Strong business and technological acumen with a proactive, solutions-driven approach.
• Excellent communication and interpersonal skills for quickly establishing and maintaining relationships.
• Strong presentation and writing skills for effective communication with internal and external stakeholders.
• Ability to manage and prioritize multiple projects simultaneously across diverse teams, including strategic, technical, and sales functions.
• Eager learner with a growth mindset and a passion for the advanced packaging and optics industry.
• Target-oriented, with a focus on achieving measurable results.
• Self-motivated, adaptable, and committed to continuous improvement.
• Organizational skills to manage complex projects and cross-functional collaboration.